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Company Overview Data

  • Profile
  • History
  • Key Financials
  • Sales by Products
  • Bod
  • Global Network
  • Shareholding
2010 Jan. 2010 Development of 44nm 2Gb Mobile DRAM
2009 Dec. 2009 Development of 44nm 2Gb GDDR5
Nov. 2009 Intel Validation of 44nm 2Gb DDR3 DRAM
Oct. 2009 Introduction of the second generation 1Gb DDR3
Aug. 2009 Intel validation of 54nm 4Gb mobile DRAM
Jun. 2009 Validation of 10 products including 4GB SoDIMM for Intel¡¯s DDR3-only platform
May. 2009 Signed the Collaboration Agreement to jointly develop controllers for NAND solutions with Numonyx and Phison
Agreed to establish a backend JV in China with Wuxi Industrial Development Group Company Ltd.
Feb. 2009 Development of 44nm DDR3 DRAM
Jan. 2009 Intel validation of 4GB DDR3 ECC UDIMM
2008 Dec. 2008 Development of 54nm 2Gb mobile DRAM
Aug. 2008 Development of 16GB RDIMM utilizing MetaRAMTM technology
Strategic alliance with Numonyx for joint development of NAND flash memory products and technology
May. 2008 Signed an amendment to strengthen long-term strategic alliance with ProMOS Technologies
Apr. 2008 Signed the License and Joint Development Agreement for STT-RAM with Grandis Inc.
Mar. 2008 Formed a strategic alliance with Fidelix Co.
2007 Nov. 2007 Signed the Partnership Agreement with SiliconFile Technologies Inc. to cooperate on the CIS business
Oct. 2007 Re-entered the non-memory business
Signed the Technology and Licensing Agreement for PRAM with Ovonyx
Aug. 2007 Signed the Technology and Licensing Agreement for ZRAM with InnovativeSilicon
Apr. 2007 Groundbreaking of 300mm fab in Cheongju, Korea
Mar. 2007 Signed the Semiconductor Patent Cross Licensing and Supply Agreement with Toshiba
Signed the Patent Cross License Agreement and MOU to form JV for x4 technology with SanDisk
Jan. 2007 Foundation of sales subsidiary in India (HSIS)
2006 Oct. 2006 Opening of the China manufacturing site
Sep. 2006 Opening of a 300mm R&D fab (R3)
Apr. 2006 Foundation of the manufacturing company in China (HSMC)
2005 Jul. 2005 Termination of the Corporate Restructuring Promotion Act and business normalization
Apr. 2005 Foundation of China JV (HSSL) with STMicroelectronics
Jan. 2005 Formed a strategic alliance with ProMOS
2001~2004 Oct. 2004 Transfer the Non-memory Business Unit to MagnaChip Semiconductor Ltd.
Aug. 2004 Signed the Cooperative Agreement with Wuxi city to establish a manufacturing site in China
Jun. 2003 Established the Environment/Safety/Health Lab
Apr. 2003 Strategic alliance with STMicroelectronics for joint development of NAND flash
Jun. 2002 Change of major shareholder to KEB
Oct. 2001 Placed under the Corporate Restructuring Promotion Act
Aug. 2001 Official disaffiliation from the Hyundai Business Group
Mar. 2001 Change of company name to ¡®Hynix Semiconductor Inc.¡¯
1983~1999 Oct. 1999 Merger with LG Semiconductor
Dec. 1996 Initial public offering
Feb. 1983 Establishment of Hyundai Electronics Industries Co., Ltd.

7th Ranking in the World¡¯s Semiconductor Market

7th Ranking in the World¡¯s Semiconductor Market



Ranked 2nd in the DRAM Market

legend
Ranked 2nd in the DRAM Market



Ranked 3rd in the NAND Flash Market

legend
Ranked 3rd in the NAND Flash Market
Consolidated (KRW billion)
2009 2008 2007 2006
Revenues 7,906 6,818 8,605 7,693
Operating Income 192 -1,920 491 2,057
Net Income -333 -4,775 361 2,055
EBITDA 2,899 1,321 2,817 3,659
 
OP Margin 12% -28% 6% 27%
Net Profit Margin -4% -70% 4% 27%
EBITDA Margin 37% 19% 33% 46%
 
Assets 16,304 16,576 17,722 15,350
  (Cash**) 1,518 719 2,038 2,156
Liabilities 10,384 11,050 8,412 6,577
  (Interest-bearing Debts***) 6,955 7,749 5,278 3,412
Shareholder's Equity 5,919 5,526 9,310 8,773
 
Debt to Equity Ratio 118% 140% 57% 39%
Net Debt to Equity Ratio 92% 127% 33% 14%

* Cash: Cash and Cash Equivalents + Short-term Financial Instruments
** Interest-bearing Dabts: Short-term Borrowings + Current Portion of Long-term Debts + Debentures + Long-term Debts

Sales by Products
  • Jong Kap Kim(Inside Director / Chairman of BOD)
  • Oh Chul Kwon
  • Jong Sun Park(Outside Director / Chairman of Strategy Committee / Member of Compensation Committee)
  • Hyeong Joon Kim(Outside Director / Member of Compensation Committee / Member of Strategy Committee)
  • Jang Bong Choi(Outside Director / Chairman of Compensation Committee / Member of Strategy Committee)
  • Boo Hwan Han(Outside Director / Member of Strategy Committee)
  • Kab Jong Paek(Outside Director / Chairman of Audit Committee / Member of Strategy Committee)
  • In Baik Jeon(Outside Director / Member of Compensation Committee / Member of Strategy Committee)
  • Byung Tae Jung(Outside Director / Member of Director Nomination Committee / Member of Strategy Committee)
  • Jae Yong Song(Outside Director / Member of Audit Committee / Member of Management Committee)
  • Chang Ho Kim(Outside Director / Member of Audit Committee / Member of Compensation Committee)
  • Sung Wook Park(Inside Director / Member of Compensation Committee / Member of Management Committee)
  • Min Chul Kim(Inside Director / Member of Compensation Committee / Member of Management Committee)

3 manufactruing sites - Icheon, Cheongju, Wixi. 30 direct sales offices in 16 countries
world map
world map

stockholder
As of April 30, 2010
590M Shares
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