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Products

PRODUCTSeMMC

Specifications

Density별 Specifications Density별 Product, NAND Information, Part Number, Package Size, Package Type 정보를 나타낸 표 입니다.
Density Product NAND Information Part Number Package Size Package Type
4GB eMMC4.5 1ynm 32Gb H26M31001HPR 11.5x13x0.8 153ball FBGA
8GB eMMC5.1 1ynm 64Gb H26M41208HPR 11.5x13x0.8 153ball FBGA
16GB eMMC5.1 1ynm 64Gb H26M52208FPR 11.5x13x0.8 153ball FBGA
eMMC5.1 1znm 128Gb H26M51002KPR 11.5x13x0.8 153ball FBGA
32GB eMMC5.1 1ynm 64Gb H26M64208EMR 11.5x13x1.0 153ball FBGA
eMMC5.1 1znm 128Gb H26M62002JPR 11.5x13x0.8 153ball FBGA
64GB eMMC5.1 1ynm 64Gb H26M78208CMR 11.5x13x1.0 153ball FBGA
eMMC5.1 1znm 128Gb H26M74002HMR 11.5x13x1.0 153ball FBGA
128GB eMMC5.1 3D-V2 128Gb H26M88002AMR 11.5x13x1.0 153ball FBGA
eMMC5.1 3D-V4 256Gb H26T87001CMR 11.5x13x1.0 153ball FBGA

Firmware Features

Firmware Features JEDEC Version별 Features, SK hynix Version(v4.41, v4.5, v5.0, v5.1) 정보를 나타낸 표 입니다.
JEDEC Version Features SK hynix Version
v4.41 v4.5 v5.0 v5.1
eMMC4.5 HS200 X O O O
Discard X O O O
Power Off Notification X O O O
Packed Command X O O O
Cache X O O O
Data Tag X O O O
Sanitize X O O O
Context ID X O O O
Large Sector Size X O O O
Real Time Clock X O O O
Dynamic Device Capacity X O O O
Extended Partition Types X O O O
Auto-BKOP X O O O
eMMC5.0 HS400 X X O O
Field FW update X X O O
PON-Sleep Clarification X X O O
Health(Smart) Report O O O O
Production State Awareness X X O O
eMMC5.1 CMD Queuing (Optional) X X X O
Cache Barrier X X X O
Cache Flushing Report X X X O
RPMB throughput Improve X X O O
BKOP control X X X O
HCI for CMD queuing X X X O
Enhanced Strobe X X X O
Secure Write Protection (Optional) X X X O

Automotive Product List

Automotive Product List Automotive Product List 정보를 Part Number, Density, Organization, Temperature, Product Grade, Voltage, PKG, Product Status로 구분하여 나타낸 표 입니다.
Part Number Density Organization Temperature Product Grade* Voltage PKG Product Status
H26M41103HPRA 8GB SDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M41103HPRI 8GB SDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M52103FMRA 16GB DDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M52103FMRI 16GB DDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M64103EMRA 32GB QDP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M64103EMRI 32GB QDP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production
H26M78103CCRA 64GB ODP -40℃ ~ 85℃ AT 3.3V/1.8V FBGA Mass Production
H26M78103CCRI 64GB ODP -40℃ ~ 85℃ IT 3.3V/1.8V FBGA Mass Production

1) AT part is in compliance with AEC-Q100 and also developed based on the Automotive base-line.
2) IT part is in compliance with TS16949 and provides the same device longevity as AT parts.