Mobile applications, such as smart phones, tablet PCs, eReaders, etc are demanding lager density & higher performance memory solutions in small form factor packaging. In applications where platform real estate is limited, this small form factor package is most useful. The high capacity memory and the enhanced performance is required to support multimedia applications offered by these mobile systems.
Hynix has completed internal qualification of 4Gb+4Gb density PoP (Package on Package) using 41nm based 4Gb SLC NAND with 54nm based 2Gb Mobile DRAM component last month, and plans to start mass production this month.
This PoP saves circuit board while providing high capacity memory. It sits on top of the application processor which simplifies layout, improves signal integrity and enhances performance.
The product is also suitable for next generation MID(Mobile Internet Device) and Smartphone as well as other high end mobile applications.
Hynix high density MCP/PoP products are offered with SDR and DDR interface,¡¿16 and ¡¿32 organizations in various memory densities. They feature high speed operation and low power consumption.
Hynix is also planning to develop higher density PoP such as 8Gb+4Gb using 44nm 2Gb Mobile DRAM in Q4 of 2010.
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